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Electronic insulation materials are mainly used for insulation protection of semiconductor components and their electronic equipment. 1 printed circuit board, that is, copper foil version. The substrate is a resin laminate, which is called a rigid copper-clad foil plate. It is usually made of a resin plate such as epoxy or phenolic. If the substrate is a polymer film or a single-layer heat-resistant glass varnish, it is called a flexible copper-clad plate. Polyester, polyimide, and fluoropolymer films are often used. 2 packaging materials to prevent the influence of external moisture and impurities on the parameters of semiconductor components. Currently, approximately 90% of semiconductor components are packaged in plastic. Epoxy resin and silicone resin are mainly used, followed by phenolic resin, polyester, polybutadiene and the like. 3 Insulation film for semiconductor devices, surface protection film for semiconductor components such as large-size film integrated circuits (including contact coating film, passivation film, moisture-proof and anti-vibration film, α-ray shielding film for preventing soft errors, etc.) and interlayer insulating film . Such as a polyimide-based aromatic heterocyclic polymer.Disposable Vape, Electronic Cigarettes, vape
November 21, 2024
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November 21, 2024
November 19, 2024
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Privacy statement: Your privacy is very important to Us. Our company promises not to disclose your personal information to any external company with out your explicit permission.